Meanwhile, The Hudson Valley Research Park facility in East Fishkill, New York, spanned 464 acres (1.88 km 2) and was the primary site of semiconductor wafer and packaging manufacture after 2002. Employment in the Burlington facility peaked in the mid-1990s, with roughly 8,500 employees. Such chips were later used in the company's System/370 Model 145 mainframe, the first computer built entirely from integrated circuits, abandoning the core memory of old. Dennard's patents developed for IBM in 1966. In 1966, this factory produced the first mass manufactured semiconductor DRAM, based on Robert H. The Burlington facility spanned 700 acres (2.8 km 2) and was the primary site of domestic semiconductor manufacture for IBM before 2002. By 2001, its operations also comprised offices in North Carolina, Minnesota, Colorado. The Microelectronics Division was formally organized in 1966. IBM Microelectronics took root from the opening of two separate facilities for microelectronics: a Burlington, Vermont, facility in 1957, and the Hudson Valley Research Park facility in 1963. It was sold to GlobalFoundries in 2015 as part of the agreement, IBM gave its Burlington and East Fishkill factories and $1.5 billion in cash to GlobalFounderies in exchange for the latter supplying high technology chips to IBM for a decade. Two facilities in Burlington, Vermont, and East Fishkill, New York, housed the majority of the division.
IBM Microelectronics Division was the semiconductor arm of International Business Machines Corporation (IBM) from 1966 to 2015. International Business Machines Corporation (IBM)
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